• 8th gen Intel® Core™ i7/i5/i3 & Celeron® with Intel® Q370 chipset (Coffee Lake-S)
  • 4-CH PoE (IEEE802.3at compliance)
  • Dual swappable 2.5″ SATA HDD drive bay with RAID 0 &1
  • Supports MXM 3.1 type A graphics module (optional)
  • DVI-I, HDMI, and DisplayPort with triple-view supported
  • AXView 3.0 intelligent remote monitoring software for IIoT

Request For Quotation

Description

SPECIFICATIONS

CPU
  • LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
Chipset
  • Intel® Q370
  • Intel® C246 PCH (optional)
System Memory
  • 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
BIOS
  • AMI
COM
  • 2 x RS-232/422/485
USB
  • 4 x USB 3.1 Gen2
  • 2 x USB 3.1 Gen1
Ethernet/PoE
  • 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
  • 4 x Power over Ethernet (IEEE802.2at), up to 60W
Display
  • 2 x DisplayPort via optional MXM kit
  • 1 x HDMI
  • 1 x DisplayPort
  • 1 x DVI-I
Digital I/O
  • N/A
Audio
  • N/A
Storage
  • 2 x 2.5″ HDD drive bay (max. up 9.5 mm height)
  • 1 x mSATA (enabled in BIOS setting)
Expansion
  • 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
  • 2 x SIM slot
  • 1 x Internal MXM3.1 type A connector
Others
  • 1 x Flexible I/O window (Default : 2 x DB9 half cut bracket)
  • 4 x SMA-type antenna connector
  • TPM 2.0
Power Supply
  • 24 VDC
Watchdog Timer
  • 255 levels, 1 to 255 sec.
Construction
  • Aluminum extrusion and heavy-duty steel, IP40
Operating Temperature
  • Without MXM module:
    -40°C to 60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
    -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W)
  • With MXM module:
    -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
Relative Humidity
  • 10% to 90%, non-condensing
Vibration
  • IEC 60068-2-64 (w/SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis)
Shock
Dimensions
(W x D x H)
  • 280 x 210 x 80.5 mm (11.02″ x 8.26″ x 3.16″)
Weight (net/gross)
  • 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
Certifications
  • CE, FCC Class A
EOS Support
  • Win 10 IoT, Linux, AXView 3.0
Mounting
  • Wall mount kit
  • DIN-rail kit

ORDERING INFORMATION

Fanless embedded system with LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor, Intel® Q370,DVI-I, HDMI, dual HDD, 4 PoE, 2 GbE, 6 USB, 2 COM and 24 VDC

  • 2.5” SATA HDD
  • 80GB or above

 

  • 2.5” SATA SSD
  • 100GB or above

 

  • DDR4 SO-DIMM
  • 4GB to 32GB

 

  • mSATA
  • 64GB or above

 

  • 8816K6718A0E
  • Wall mount kit

 

  • 8816K6719A0E
  • DIN-rail kit

 

  • 8816K6603A0E
  • Wi-Fi module

 

  • 3G/LTE module

 

  • MXM 3.1 Type A module

 

  • 50906D24000E
  • 24V, 120W adapter

 

  • AX92903 (E392903102)
  • CANbus PCI Express Mini module

 

  • AX92903 (E392903103)
  • CAN module with CANOpen

 

  • AX92902 (392902103)
  • LAN PCI Express Mini module

 

  • AX92906 (E392906101)
  • COM PCI Express Mini module

 

  • AX92904 (E392904102)
  • DIO PCI Express Mini module