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  • 8th gen Intel® Core™ i7/i5/i3 & Celeron® with Intel® Q370 chipset (Coffee Lake-S)
  • 4-CH PoE (IEEE802.3at compliance)
  • Dual swappable 2.5″ SATA HDD drive bay with RAID 0 &1
  • Supports MXM 3.1 type A graphics module (optional)
  • DVI-I, HDMI, and DisplayPort with triple-view supported
  • AXView 3.0 intelligent remote monitoring software for IIoT

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    Category:

    Description

    SPECIFICATIONS

    CPU
    • LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
    Chipset
    • Intel® Q370
    • Intel® C246 PCH (optional)
    System Memory
    • 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
    BIOS
    • AMI
    COM
    • 2 x RS-232/422/485
    USB
    • 4 x USB 3.1 Gen2
    • 2 x USB 3.1 Gen1
    Ethernet/PoE
    • 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
    • 4 x Power over Ethernet (IEEE802.2at), up to 60W
    Display
    • 2 x DisplayPort via optional MXM kit
    • 1 x HDMI
    • 1 x DisplayPort
    • 1 x DVI-I
    Digital I/O
    • N/A
    Audio
    • N/A
    Storage
    • 2 x 2.5″ HDD drive bay (max. up 9.5 mm height)
    • 1 x mSATA (enabled in BIOS setting)
    Expansion
    • 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
    • 2 x SIM slot
    • 1 x Internal MXM3.1 type A connector
    Others
    • 1 x Flexible I/O window (Default : 2 x DB9 half cut bracket)
    • 4 x SMA-type antenna connector
    • TPM 2.0
    Power Supply
    • 24 VDC
    Watchdog Timer
    • 255 levels, 1 to 255 sec.
    Construction
    • Aluminum extrusion and heavy-duty steel, IP40
    Operating Temperature
    • Without MXM module:
      -40°C to 60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
      -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W)
    • With MXM module:
      -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
    Relative Humidity
    • 10% to 90%, non-condensing
    Vibration
    • IEC 60068-2-64 (w/SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis)
    Shock
    • IEC 60068-2-27 (w/SSD: 50G@wall mount,half sine, 11 ms duration)
    Dimensions
    (W x D x H)
    • 280 x 210 x 80.5 mm (11.02″ x 8.26″ x 3.16″)
    Weight (net/gross)
    • 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
    Certifications
    • CE, FCC Class A
    EOS Support
    • Win 10 IoT, Linux, AXView 3.0
    Mounting
    • Wall mount kit
    • DIN-rail kit

    ORDERING INFORMATION

    Fanless embedded system with LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor, Intel® Q370,DVI-I, HDMI, dual HDD, 4 PoE, 2 GbE, 6 USB, 2 COM and 24 VDC

    • 2.5” SATA HDD
    • 80GB or above

     

    • 2.5” SATA SSD
    • 100GB or above

     

    • DDR4 SO-DIMM
    • 4GB to 32GB

     

    • mSATA
    • 64GB or above

     

    • 8816K6718A0E
    • Wall mount kit

     

    • 8816K6719A0E
    • DIN-rail kit

     

    • 8816K6603A0E
    • Wi-Fi module

     

    • 3G/LTE module

     

    • MXM 3.1 Type A module

     

    • 50906D24000E
    • 24V, 120W adapter

     

    • AX92903 (E392903102)
    • CANbus PCI Express Mini module

     

    • AX92903 (E392903103)
    • CAN module with CANOpen

     

    • AX92902 (392902103)
    • LAN PCI Express Mini module

     

    • AX92906 (E392906101)
    • COM PCI Express Mini module

     

    • AX92904 (E392904102)
    • DIO PCI Express Mini module

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